Advanced temperature monitoring system with expandable modular layout design

ABSTRACT

Embodiments herein provide methods of monitoring temperatures of fluid delivery conduits for delivering fluids to, and other components external to, a processing volume of a processing chamber used in electronic device fabrication manufacturing, and monitoring systems related thereto. In one embodiment, a method includes receiving, at the temperature monitoring system (TMS) controller, information from a first plurality of temperature sensors and a second plurality of temperature sensors, comparing, using the TMS controller, the temperature information to one or more pre-determined control limits, and communicating, using the TMS controller, an out-of-control event to a user. Generally, the temperature monitoring system features the first and second pluralities of temperature sensors, the TMS controller, a first connection module, and a second connection module.

BACKGROUND Field

Embodiments described herein generally relate to the field ofsemiconductor device manufacturing, and more particularly, to methods ofmonitoring components external to a processing volume of a processingchamber used in electronic device manufacturing, and monitoring systemsrelated thereto.

Description of the Related Art

As circuit densities increase for next generation devices and transistordimensions continue to shrink, clean, contamination free substrateprocessing environments become increasingly important. This is becauseundesirable particle contaminants on a surface of a substrate before,during, and/or after processing thereof, can adversely affect deviceperformance and/or suppress device yield (the percentage of devices thatconform to performance specifications out of a total number of devicesmanufactured). One known source of particle contamination results fromcondensation of vapor-phase precursors in fluid delivery conduitsbetween a vapor-phase precursor source and a processing volume of aprocessing chamber.

Vapor-phase delivery systems, also known as vaporized liquid deliverysystems, are commonly used in deposition processes, such as chemicalvapor deposition (CVD) processes, atomic layer deposition (ALD)processes, or etch processes, where vapor-phase and sometimes gasprecursors are reacted with, and/or on, the surface of a substrate todeposit a material layer thereon or to remove a portion of a materiallayer therefrom. Vapor-phase delivery systems provide gas flow controland delivery of precursors that are otherwise in a liquid-phase or asolid-phase at ambient temperature and below and at atmospheric pressureand above.

Vapor-phase delivery systems commonly use an evaporation source, such asa heating vessel, to transition the precursor from a liquid-phase or asolid-phase to a vapor-phase. Typically, during the processing of asubstrate, the vapor-phase precursor flows into a processing volume of aprocessing chamber, such as a CVD processing chamber, an ALD processingchamber, or an etch processing chamber, through a delivery conduit, anda surface of the substrate is exposed thereto. Often, the deliveryconduit is heated, such as with a flexible polymer heater jacketcomprising a resistive heating element or with heater tape wrappedaround the delivery conduit and an insulating cover disposed thereover.Heating the delivery conduit along the length thereof preventscondensation of the vapor-phase precursor therein. Nonetheless,non-uniform temperatures along the walls of the delivery conduit, suchas cold spots, can result in undesirable condensation and/or depositionof the precursor on the inner surfaces thereof.

Unfortunately, undesirable condensation or deposition of the precursorin the delivery conduit leads to undesirable particle contamination inthe processing volume and on the surface of the substrate disposedtherein. Further, because flowrates of the vapor-phase precursors intothe processing volume are often dependent on the temperature of both theevaporation source and the delivery conduit, non-uniform temperaturescan undesirably impact the flowrate of the vapor-phase precursor.Changes in the flowrate of the vapor-phase precursor may affect thedeposition rate and the material properties of the material layerdeposited on the surface of the substrate.

Non-uniform temperatures along the delivery conduit can be the result ofimproper installation of a heater jacket, failure of the heatingelements in the heating jacket, or failure of portions of heatingelements. Non-uniform temperatures can also be the result of undesirablerepositioning of the heating jacket during maintenance of the processingsystem, during maintenance of systems thereby, during facilitiesmaintenance, or due to unintentional contact therewith. Often,non-uniform temperatures along the delivery conduit are not discovereduntil after resulting condensations in the delivery line causes aprocess excursion, such as a defectivity excursion, where particlecontamination is found on the surface of a substrate after processingthereof or when suppressed device yield is traced back to the processingchamber through a commonality of substrates (having suppressed deviceyield) processed therethrough.

Further, conventional substrate processing systems are typicallyconfigured to monitor temperature measurements related to the substrateprocessing environment in the processing volume thereof. Generally,these processing systems lack the capability and flexibility to monitortemperature information related to processing components external to thesubstrate processing environment. High substrate processingtemperatures, e.g., more than about 650° C., in the processing volumemay adversely impact the performance and reliability of processingsystem components external to the processing volume but in thermalcommunication therewith.

Accordingly, what is needed in the art are methods of monitoringtemperatures of delivery conduits to, and other components that areexternal to, a processing volume of a processing chamber used inelectronic device fabrication manufacturing, and monitoring systemsrelated thereto.

SUMMARY

Embodiments of the disclosure generally relate to substrate processingsystems used in electronic device fabrication processes. Morespecifically, embodiments herein relate to methods of monitoringtemperatures of delivery conduits to, and other components external to,a processing volume of a processing chamber used in electronic devicefabrication manufacturing, and monitoring systems related thereto.

In one embodiment, a method of monitoring, using a temperaturemonitoring system (TMS), a plurality of surfaces of the one or moreprocessing systems for changes in temperature in provided. The methodincludes receiving, at the temperature monitoring system (TMS)controller, information from a first plurality of temperature sensorsand a second plurality of temperature sensors, comparing, using the TMScontroller, the temperature information to one or more pre-determinedcontrol limits, and communicating, using the TMS controller, anout-of-control event to a user. Generally, the temperature monitoringsystem features the first and second pluralities of temperature sensors,the TMS controller, a first connection module, and a second connectionmodule. Here, the first connection module comprises a first housinghaving one or more first terminal blocks disposed therein, secondconnection module comprises a second housing having one or more secondterminal blocks disposed therein, and individual ones of the first andsecond pluralities of temperature sensors are disposed in locationsexternal to one or more processing volumes of one or more correspondingprocessing chambers within the one or more processing systems. In someembodiments, each of the first plurality of temperature sensors arecoupled to corresponding connection terminals of the one or more firstterminal blocks, each of the second plurality of temperature sensors arecoupled to corresponding connection terminals of the one or more secondterminal blocks. In some embodiments, the first and second connectionmodules are arranged in series so that the first connection module iscoupled to the second connection module using a first cable and thesecond connection module is coupled to the TMS controller using a secondcable. Typically, the out of control event comprises a temperaturemeasurement above or below the one or more pre-determined controllimits.

In another embodiment, a method of detecting processing temperatureexcursions in a processing system is provided. the method includesreceiving, at a temperature monitoring system (TMS) controller,information from a plurality of temperature sensors disposed external toa processing volume of a processing chamber, storing, in a memory of theTMS controller, data corresponding to the information received from eachof the plurality of temperature sensors, comparing the data to one ormore process control models, determining, based on the comparison of thedata to the one or more process control models, whether a temperatureexcursion event has occurred, and displaying, for a user, a visualrepresentation of temperature excursion events corresponding to each ofthe plurality of temperature sensors.

In another embodiment, a temperature monitoring system is provided. Thetemperature monitoring system includes a first plurality of temperaturesensor, a second plurality of temperature sensors, a temperaturemonitoring system (TMS) controller, a first connection module, and asecond connection module. Here, the first connection model features afirst housing and one or more first terminal blocks disposed therein andthe second connection module features a second housing having one ormore second terminal blocks disposed therein. Generally, each of thefirst plurality of temperature sensors are coupled to correspondingconnection terminals of the one or more first terminal blocks and eachof the second plurality of temperature sensors are coupled tocorresponding connection terminals of the one or more second terminalblocks. In some embodiments, the first and second connection modules arearranged in series so that the first connection module is coupled to thesecond connection module using a first cable and the second connectionmodule is coupled to the TMS controller using a second cable.

BRIEF DESCRIPTION OF THE DRAWINGS

So that the manner in which the above recited features of the presentdisclosure can be understood in detail, a more particular description ofthe disclosure, briefly summarized above, may be had by reference toembodiments, some of which are illustrated in the appended drawings. Itis to be noted, however, that the appended drawings illustrate onlytypical embodiments of this disclosure and are therefore not to beconsidered limiting of its scope, for the disclosure may admit to otherequally effective embodiments.

FIG. 1 is a schematic sectional view of a single chamber processingsystem according to one embodiment.

FIG. 2 is a schematic plan view of a multi-chamber processing system anda schematic representation of an advanced temperature monitoring systemused therewith, according to one embodiment.

FIG. 3 is a schematic representation of an advanced temperaturemonitoring system configured for use with a plurality of multi-chamberprocessing systems, according to one embodiment.

FIG. 4 is a schematic representation of an advanced temperaturemonitoring system configured for use with a plurality of multi-chamberprocessing systems, according to another embodiment.

FIG. 5 is a diagram illustrating a method of monitoring a processingsystem, according to one embodiment.

FIGS. 6A-6D are schematic representations of statistical process controlgraphs, according to one embodiment, which may be used with the methodsdescribed herein.

FIG. 7 is a schematic representation of a visual display, according toone embodiment, which may be used with the methods described herein.

FIG. 8 is a diagram illustrating a method of controlling a processingsystem using the advanced temperature monitoring systems describedherein.

To facilitate understanding, identical reference numerals have beenused, where possible, to designate identical elements that are common tothe figures. It is contemplated that elements and features of oneembodiment may be beneficially incorporated in other embodiments withoutfurther recitation.

DETAILED DESCRIPTION

Embodiments of the disclosure generally relate to substrate processingsystems used in electronic device fabrication processes. Morespecifically, embodiments herein relate to methods of monitoringtemperatures of fluid delivery conduits to, and other componentsexternal to, a processing volume of a processing chamber used inelectronic device fabrication manufacturing, and advanced temperaturemonitoring systems related thereto.

FIG. 1 is a schematic sectional view of a single chamber processingsystem, according to one embodiment. The processing system 100 includesa processing chamber 102 and a vapor-phase precursor delivery system140. Here, the processing chamber 102 is chemical vapor deposition (CVD)chamber, specifically a plasma enhanced CVD chamber. In otherembodiments, the processing chamber is any processing chamber configuredto process a substrate using vapor-phase precursors by exposing asurface of a substrate thereto, or any processing chamber where remotemonitoring of components external to a processing volume thereof isdesired. For example, in some embodiments the systems and methodsdescribed herein are adapted for use with a thermal CVD chamber, anatomic layer deposition (ALD) chamber including a plasma enhanced ALDchamber, an etch chamber, such as a plasma enhanced etch chamber, athermal processing chamber, an implant chamber, or combinations thereof.

As shown in FIG. 1, the processing chamber 102 features a lid assembly103, one or more sidewalls 104, and a chamber bottom 105 whichcollectively define a processing volume 106. A gas distributer 107commonly referred to as a showerhead, having a plurality of openings 108disposed therethrough, is disposed in the lid assembly 103 and is usedto uniformly distribute processing gases, including vapor-phaseprecursors, from a gas inlet 109 into the processing volume 106. The gasdistributer 107 is coupled to a power supply 110, such as an RF or VHFpower supply, which supplies the power to ignite and maintain aprocessing plasma, here the plasma 111, composed of the processing gasesthrough capacitive energy coupling therewith. The processing volume 106is fluidly coupled to a chamber exhaust 117 through a vacuum outlet 112,such as to one or more dedicated vacuum pumps, e.g., a turbo pump, arough pump, or a combination thereof. The chamber exhaust 117 maintainsthe processing volume 106 at sub-atmospheric conditions and evacuatesprocessing and other gases therefrom.

In some embodiments, an exhaust conduit 161 fluidly coupling theprocessing volume 106 to the chamber exhaust 117 is heated to preventcondensation of unreacted vapor-phase precursors or deposition of theprecursor in the exhaust conduit 161 at a location proximate to theprocessing volume 106. A substrate support assembly 113, disposed in theprocessing volume 106 is disposed on a support shaft 114 sealinglyextending through the chamber bottom 105. A first bellows 115circumscribes the support shaft 114 and is coupled to the chamber bottom105 and a first actuator 116 to provide a flexible seal therebetween andto maintain the vacuum integrity of the processing volume 106. Thesupport shaft 114 is coupled to the first actuator 116 which isconfigured to raise and lower the support shaft 114, and thus thesubstrate support assembly 113 disposed thereon, to facilitateprocessing of a substrate 119 and transfer thereof to and from theprocessing chamber 102.

The substrate 119 is loaded into, and removed from, the processingvolume 106 through an opening 120 in one of the one or more sidewalls104, which is conventionally sealed with a door or a valve (not shown)during substrate processing. A plurality of lift pins 121 disposedabove, but engageable with, a lift pin hoop 122 are movably disposedthrough the substrate support assembly 113 to facilitate transferring ofthe substrate 119 to and from a substrate receiving surface thereof. Thelift pin hoop 122 is coupled to a lift hoop shaft 123 extending throughthe chamber bottom 105, which raises and lowers the lift pin hoop 122using a second actuator 124 coupled to the lift hoop shaft 123. A secondbellows 125 circumscribes the lift hoop shaft 123 and is coupled to thechamber bottom 105 and the second actuator 124 to provide a flexibleseal therebetween and to maintain the vacuum integrity of the processingvolume 106. When the lift pin hoop 122 is in a raised position, theplurality of lift pins 121 are contacted from below and moved to extendabove a substrate receiving surface of the substrate support assembly113 lifting the substrate 119 therefrom and enabling access to thesubstrate 119 by a robot handler (not shown). When the lift pin hoop 122is in a lowered position the tops of the plurality of lift pins 121 areflush with, or below, the receiving surface of the substrate supportassembly and the substrate 119 rests thereon.

Typically, the substrate support assembly 113 includes a support base126 and a substrate support 127 thermally coupled to, and disposed on,the support base 126. In some embodiments, the support base 126 is usedto regulate the temperature of the substrate support 127, and thesubstrate 119 disposed on the substrate receiving surface of thesubstrate support 127, during processing. The support base 126 hereinincludes one or more cooling channels 128 disposed therein that arefluidly coupled to, and in fluid communication with, a coolant source130 through one or more coolant lines 129. Typically, the coolant source130 is a refrigerant source or water source having a relatively highelectrical resistance.

Herein, the support base 126 is formed of a corrosion resistantthermally conductive material, such as a corrosion resistant metal, forexample aluminum, an aluminum alloy, or stainless steel, and isthermally coupled to the substrate support 127 with an adhesive or bymechanical means. The substrate support 127 is typically formed of adielectric material, such as a metal oxide or a metal nitride, forexample aluminum oxide, and, in some embodiments, includes one or moreheaters 131, such as one or more resistive heating elements, embeddedtherein. In some embodiments, the substrate support assembly 113includes both the one or more heaters 131 and cooling channels 128 toenable fine temperature control of the temperature of the substratesupport 127 and the substrate 119 disposed thereon. Typically, thesubstrate 119 is secured to the substrate support 127 by means of anelectrostatic chucking (ESC) force. The chucking force is a function ofa potential between a voltage provided to a chucking electrode (notshown) embedded in the dielectric material of the substrate support 127and the substrate 119 disposed thereon. In some embodiments, thesubstrate support assembly 113 further includes one or more biaselectrodes (not shown) embedded in the dielectric material of thesubstrate support 127, where the one or more bias electrodes are coupledto one or more bias power supplies (not shown).

The precursor delivery system 140 includes one or more vapor-phaseprecursor sources 141 disposed in, or coupled to, a gas supply cabinet142. The vapor-phase precursor source 141 vaporizes a liquid precursor,provided from a liquid-phase precursor ampoule 143 in fluidcommunication therewith, using a thermal and/or vacuum enhancedvaporization process. In other embodiments, the vapor-phase precursorsource 141 is a liquid injection vaporizer configured to provide amixture of the vapor-phase precursor and a carrier gas to the processingvolume 106 of the processing chamber 102. In some embodiments, thevapor-phase precursor source 141 is configured to vaporize or sublimatea solid precursor.

During substrate processing operations, one or more vapor-phaseprecursors flow into the processing volume 106 through a deliveryconduit 144 in fluid communication therewith. Typically, the deliveryconduit 144 is disposed in a heater jacket 146, configured to supplyheat energy to maintain the delivery conduit 144 at a desiredtemperature, along the length thereof. In some embodiments, the heaterjacket 146 is formed of a flexible polymer material and includes one ormore resistive heating elements (not shown) where the one or moreresistive heating elements is disposed proximate to, disposed on, and/orin intimate contact with the delivery conduit 144. In other embodiments,the delivery conduit 144 is maintained at a desired temperature using aheater tape (not shown) wrapped around the conduit along the length, oralong portions of the length, thereof.

The vapor-phase precursor source 141 may be located remote from theprocessing chamber 102, such as in a sub-fab (typically a building floorbeneath the floor where the processing chamber 102 is located, i.e.,below a cleanroom area where the processing chamber 102 is located) ormay be located proximate to and/or adjacent to the processing chamber.

In embodiments herein, temperatures of one or more system components ofthe processing system 100 are monitored using a plurality of firstsensors 145 and/or a plurality of second sensors 185. The first sensors145 and the second sensors 185 comprise components of an advancedtemperature monitoring system 220 described below. Examples of suitablesensors which may be used as the first sensors 145 and/or the secondsensors 185 include thermocouples, such any one or combination of K, J,E, T, R, S, B, N, and/or W type thermocouples, resistance temperaturedetectors (RTD), voltage output temperature sensors, and combinationsthereof.

Here, the plurality of first sensors 145 are used to measuretemperatures of the delivery conduit 144 and the plurality of secondsensors 185 are used to measure temperatures of other components of theprocessing system 100 and/or the multi-chamber processing system 200 ofFIG. 2. For example, in some embodiments individual ones of theplurality of first sensors 145 are disposed on, disposed proximate to,disposed adjacent to, and/or disposed in intimate contact with thedelivery conduit 144 at a respective plurality of locations along thelength thereof. Each of the plurality of first sensors 145 measures atemperature of a surface of the delivery conduit 144 and/or atemperature proximate to a surface of the delivery conduit 144 atrespective locations along the length thereof.

In some embodiments, one or more of the plurality of first sensors 145are positioned at locations where non-uniform temperature excursions maybe considered more likely to occur, such as in a location where thedelivery conduit passes through an opening formed in a sheet metal wall,such as an opening formed in the gas supply cabinet 142, or an openingformed in a floor between a sub-fab and a cleanroom, or at locations ofbends in the delivery conduit 144, or at locations where the deliveryconduit 144 and/or the heater jacket 146 are likely to be inadvertentlycontacted, such as in high foot traffic areas, or at locations where oneor more segments of the heater jacket 146 are joined. In someembodiments, the plurality of first sensors 145 are spaced apart atregular intervals along the length, or along portions of the length, ofthe delivery conduit 144.

Generally, the one or more second sensors 185 are disposed on, locatedproximate to, located adjacent to, or in intimate contact with surfacesof components of the processing system 100. For example, in someembodiments, one or more second sensors 185 are disposed on an exhaustconduit 161 or foreline fluidly coupling the processing volume 106 tothe chamber exhaust 117 or fluidly coupling one or more vacuum pumps ofthe chamber exhaust 117 to one another. In some embodiments, one or moresecond sensors 185 are disposed on, in, and/or proximate to the gassupply cabinet 142 and/or on the liquid-phase precursor ampoule 143enabling monitoring of the gas supply cabinet environment and/or theprecursor ampoule respectively. In some embodiments, one or more secondsensors 185 are disposed on surfaces of the processing chamber 102external to the processing volume 106, such as on and/or proximate tothe door or valve (not shown) used to seal the opening 120 to theprocessing volume 106. In some embodiments, one or more second sensors185 are disposed on the support shaft 114 of the substrate supportassembly 113 in a location external to the processing volume 106 or onthe lift hoop shaft 123 in a location external to the processing volume106, and/or on the respective actuators 116, 124 coupled thereto.

The advanced temperature monitoring systems 220, 320, and 420 describedbelow provide flexible and expandable configurations of connectionmodules 222, terminal blocks 228, and housings 226 which may be usedwith any desired configuration of temperature sensors, e.g., the firstand second sensors 145, 185. Beneficially, the advanced temperaturemonitoring systems 220, 320, and 420 desirably provide flexible sensor145, 185 and wiring management, e.g., electrical conductor 232, layoutschemes, which are suitable for use, and thus productizable, in asemiconductor device manufacturing facility, i.e., a “fab.”

Here, the one or more second sensors 185 may be positioned at one ormore desired locations on and/or proximate to the processing system 100for purposes of troubleshooting processing and/or equipment performanceissues related thereto. Embodiments where the advanced monitoring system220 includes one or more second sensors 185 disposed in locationsexternal to a processing volume of a processing chamber are suitable foruse with any substrate processing system where remote monitoring ofprocessing system temperatures is desired, including use with CVDchambers, ALD chambers, etch chambers, physical vapor deposition (PVD)chambers, implant chambers, and/or thermal processing chambers.

FIG. 2 is a schematic top view of a multi-chamber processing system 200and an advanced temperature monitoring system 220 which may be usedtherewith, according to one embodiment. Here, the multi-chamberprocessing system 200 includes a plurality of the processing systems 100described in FIG. 1, a substrate handling system 202, and a systemcontroller 207. The substrate handling system 202 includes one or moreload lock chambers 204 and a transfer chamber 205 (shown with the topremoved) having a robot handler 203 disposed therein. In someembodiments, one or more second sensors 185 are disposed on, locatedproximate to, located adjacent to, and/or in intimate contact withsurfaces of the load lock chambers 204, the transfer chamber 205 and therobot handler 203 disposed therein, and/or components thereof or relatedthereto, such as a motor coupled to the robot handler 203. For example,in some embodiments one or more second sensors 185, are disposed on, in,proximate to, adjacent to, or intimate contact with doors or valvesdisposed between load lock chambers 204 and the transfer chamber 205 ordoors or valves disposed between the transfer chamber 205 and processingchambers 102.

Here, the system controller 207 is used to control the operation of theload lock chambers 204, the transfer chamber 205 and the robot handler203 disposed therein, and the individual operation of each of theplurality of processing systems 100. For example, for each of theprocessing systems 100, the system controller 207 may be used to controlthe process sequence, regulate the gas flows, including vapor-phaseprecursors, from the precursor source 141 into the processing volume106, to heat and cool and/or maintain the substrate support 127 and thesubstrate 119, disposed on a substrate receiving surface thereof at adesire temperature, ignite and maintain the plasma 111 by controllingthe power provided to the lid assembly 103 by the power supply 110, andcontrol substrate handling operations including raising and lowering ofthe support shaft 114 and/or the lift hoop shaft 123 by the first andsecond actuators 116 and 124 respectively.

Here, the system controller 207 includes a central processing unit (CPU)209, a memory 211, and support circuits 213. The CPU 209 is a generalpurpose computer processor configured for use in an industrial settingfor controlling processing chamber and sub-processors related thereto.The memory 211 herein includes random access memory, read only memory,floppy or hard disk drive, or other suitable forms of digital storage,local or remote. The support circuits 213 are conventionally coupled tothe CPU 209 and comprise cache, clock circuits, input/output subsystems,power supplies, and the like, and combinations thereof. In someembodiments, the system controller 207 further includes one or morecomputer readable media (not shown).

Computer readable media herein includes any device, located eitherlocally or remotely from the system controller 207, which is capable ofstoring information that is retrievable by a computing device. Examplesof computer readable media useable with embodiments of the presentdisclosure include solid state memory, floppy disks, internal orexternal hard drives, and optical memory (CDs, DVDs, BR-D, etc). In oneembodiment, the computer readable media comprises the memory 211.Further, any connection is properly termed a computer-readable medium.For example, when instructions are transmitted from a website, server,or other remote source using a coaxial cable, fiber optic cable, twistedpair, digital subscriber line (DSL), or wireless technologies such asinfrared (IR), radio, and microwave, then the coaxial cable, fiber opticcable, twisted pair, DSL, or wireless technologies such as infrared,radio, and microwave are included in the definition of medium. Softwareroutines, when executed by the CPU 209, transform the CPU into aspecific purpose computer, herein the system controller 207, whichcontrols the operation of the multi-chamber processing system 200, suchthat the processes are performed in accordance with embodiments of thedisclosure. In some embodiments, the software routines are stored and/orexecuted by a second controller (not shown) that is located remotelyfrom multi-chamber processing system 200. In other embodiments, theprocesses described herein, or portions thereof, are performed by one ormore application specific integrated circuits (ASIC) or other types ofhardware implementations. In some other embodiments, the processesdescribed herein are performed by a combination of software routines,ASIC(s), and/or other types of hardware implementations.

The advanced temperature monitoring system 220 includes the firstsensors 145, the second sensors 185, a plurality of connection modules222, and an advanced temperature monitoring system (ATMS) controller224. As shown in FIG. 2, each of the plurality of connection modules 222includes a housing 226, one or more terminal blocks 228 disposed withinthe housing 226, and an optional cold-junction compensation (CJC)temperature sensor 230. The CJC temperature sensor 230 may be used toprovide a reference cold junction temperature for use in determining thehot junction temperature at a desired measuring point.

Generally, each of the terminal blocks 228 includes between about 10 andabout 30 connection terminals 229, such as about 20 connection terminals229, each configured to receive one or more electrical conductors 232,e.g., wires or cables, which connects a corresponding sensor 145, 185 tothe terminal block 228. Here, each of the connection modules 222 isexpandable to include between 1 and 30 terminal blocks 228. Thus, eachof the connection modules 222 may be configured to provide between about10 and 900 connection terminals 229, such as about 200 connectionterminals 229. In the multi-chamber processing system 200 of FIG. 2 eachof the connection modules 222 provides connection terminals 229 forpluralities of sensors 145, 185 corresponding to an individualprocessing system 100 and/or the substrate handling system 202. In otherembodiments, each of the connection modules 222 may be configured toprovide connection terminals 229 for sensors 145, 185 corresponding tomore than one processing system 100 and/or to one or more processingsystems 100 and the substrate handling system 202.

In FIG. 2, the plurality of connection modules 222 are arranged inseries so that each individual one of the plurality of connectionmodules 222 is coupled to another individual one of the plurality ofconnection modules 222 using a connection cable 234 disposedtherebetween. Here, at least one of the connection modules 222 in theseries of connection modules 222 is coupled to the ATMS controller 224using a connection cable 234.

The ATMS controller 224 includes a central processing unit (CPU) 236, amemory 238, and support circuits 240, and a multi-channelanalog-to-digital (ND) convertor 242. The ATMS controller 224 is used toconvert electrical signals received from the first and second sensors145, 185 into temperature data, monitor the temperature data forundesirable temperature excursions in real time, generate historicaldata for storage, perform statistical analysis of the historical data,and/or flag temperature excursions, i.e., temperature changes beyond anacceptable range, to a user. The CPU 236, memory 238, and supportcircuits 240 may be the same or substantially similar to the CPU 209, amemory 211, and support circuits 213 described above with respect to thesystem controller 207. The A/D convertor 242 is used to convert analogvoltage signals received from the sensors 145, 185, via the plurality ofconnection modules, into digitized information, i.e., temperature data.Software routines, when executed by the CPU 236, transform the CPU 236into a specific purpose computer, herein the ATMS controller 224.Typically, the ATMS controller 224 is communicatively coupled to thesystem controller 207 through a wired communication link 244, e.g., anEthernet cable. In some embodiments, the communication link 244comprises a wireless communication protocol. In some embodiments, theATMS controller 224 is communicatively coupled to a fab-level controlsystem 246, such as described below. In other embodiments, the ATMScontroller 224 is operated independently, e.g., without communication orcommunicative coupling with the system controller 207 and the fab-levelcontrol system 246.

The system controller 207 provides system processing information, suchas substrate processing information and/or maintenance operationinformation, to the ATMS controller 224 through the communication link244. System processing information herein relates to instructionsexecuted by the system controller 207 to the control the operation ofthe multi-chamber processing system 200. In some embodiments, systemprocessing information further includes conditions of the multi-chamberprocessing system 200, such as substrate processing conditions,communicated to the system controller 207 by processing conditionsensors disposed in, on, proximate to, or adjacent to the processingsystem, for example pressure sensors, temperature sensors, and/orflowrate sensors (including flowmeters).

Typically, system controllers configured for use with substrateprocessing systems in semiconductor device manufacturing, such as thesystem controller 207, have at least two modes for controlling theoperation of the multi-chamber processing system 200. The first mode, aprocessing mode, controls substrate processing and processing systemoperations related thereto. The second mode, a maintenance mode, allowsa user, typically a maintenance technician or engineer, to conductmaintenance procedures on the processing system, for example venting theprocessing volume of the processing chamber to atmosphere to enable theuser to open the processing chamber and have access thereinto.

System processing information related to substrate processing when themulti-chamber processing system 200 is in a processing mode includes thebeginning of a substrate processing sequence, the end of a substrateprocessing sequence, and/or substrate processing sequence activitiestherebetween. Examples of process sequence activates include thebeginning and end of pumping down the processing volume 106 to a desiredprocessing pressure, flowing processing gases into the processing volume106, igniting the plasma 111, and/or chucking the substrate 119 to thesubstrate support 127. In some embodiments, the system processinginformation further includes processing chamber conditions before,during, and/or after substrate processing therein, for example, thepressure in the processing volume 106, the temperature of the substratesupport 127, and, sometimes, the temperature of the substrate 119.

In some embodiments, the system processing information further includesa process recipe (instructions provided by the system controller 207with respect to processing conditions for a particular substrate or typeof substrate) corresponding to the process sequence. System processinginformation related to equipment maintenance typically includes thebeginning of maintenance mode (instructions to the system controller 207allowing access by a user to maintenance functions executed by thesystem controller 207), the end of maintenance mode, and/or maintenanceactivities therebetween performed using the system controller 207, forexample venting the processing volume 106 to atmosphere to enable accessthereinto or pumping down the processing volume 106 to a desired vacuumcondition after closure thereof. In some embodiments, the systemprocessing information further includes processing chamber conditionssuch as pressure and temperature during maintenance operations thereon.Herein, system processing information is received by the ATMS controller224 contemporaneously with the processing event (e.g., the beginning ofa substrate processing sequence) and in parallel with digitizing sensorinformation received from the sensors 145, 185.

In one embodiment, the ATMS controller 224 uses system processinginformation and temperature sensor information (received in parallel) togenerate historical data for storage and retrieval, and/orcontemporaneous statistical data analysis. Herein, historical dataindicates a subset of the temperature data which is suitable for storageand retrieval and/or use with conventional statistical process controlmethods. For example, in one embodiment, historical data generated bythe ATMS controller 224 includes individual temperatures, herein T_(n),measured by each of the plurality of first sensors 145 at locationsalong the delivery conduit 144, corresponding system processinginformation, and the respective day(s) and time(s) correspondingthereto. In another embodiment, the historical data includes an averageof the temperatures, herein T_(avg), measured by the plurality of firstsensors 145 at locations along the delivery conduit 144, correspondingsystem processing information, and the respective day(s) and time(s)corresponding thereto.

In another embodiment, the historical data includes a difference in thetemperatures measured by the plurality of first sensors 145 disposed atlocations along the delivery conduit 144, such as the difference betweenthe maximum measured temperature and the minimum measured temperature,herein ΔT, and/or the standard deviation of the measured temperatures,herein T_(stdev), corresponding system processing information, and theday(s) and time(s) corresponding thereto. In other embodiments, thehistorical data includes individual temperatures measured by one or moreof the second sensors 185, corresponding system processing information,and the respective day(s) and time(s) corresponding thereto.

In some embodiments, the ATMS controller 224 is configured to monitorhistorical data using statistical process control methods. For example,in some embodiments, the historical data is plotted on a graph withpre-determined control limits and/or otherwise compared to one or morepre-determined control limits and flagged if a data point (e.g., one ormore temperature measurements, or one or more values calculated using aplurality of temperature measurements), for a specified processing event(e.g., the beginning of a substrate processing sequence) falls aboveand/or below the one or more pre-determined control limits. In someembodiments, the ATMS controller 224 is configured to alert a user to anout-of-control event (when one or more data points falls outside of theone or more pre-determined control limits). Typically, once alerted, theuser will initiate a pre-determined action plan to troubleshoot theout-of-control event, also known as out-of-control action plan (OCAP),typically a flowchart that guides the users response to theout-of-control event.

Herein, alerting a user to an out-of-control event includes any form ofalert designed to communicate the out-of-control event to a desireduser, including visual and audio alarms and/or electronic messaging,e.g., automatically generated email and/or automatically generated textmessages. In some embodiments, the ATMS controller 224 is configured tocommunicate the out-of-control event to the system controller 207 andthe system controller 207 is configured to sound an alarm and/or suspendsubstrate processing operations. In some embodiments, the ATMScontroller 224 is configured to communicate historical data and/orout-of-control events to a fab-level control system 246 communicativelycoupled thereto. Typically, the system controller 207 is communicativelycoupled to the fab-level control system 246. Thus, in some embodimentsthe ATMS controller 224 may be used to communicate historical dataand/or out-of-control events to the fab-level control system 246 and thefab-level control system 246 may be used to communicate the systemcontroller 207 and/or instruct the system controller 207 to sound analarm and/or suspend substrate processing operations.

In some embodiments, the ATMS controller 224 is configured tocontemporaneously monitor the temperature data received from the sensors145, 185 and to trigger an alarm event if the temperature data fallsoutside of predetermined control limits. In some of those embodiments,the ATMS controller 224 is configured to generate and store historicaldata related to the alarm event. Examples of statistical process controlmodels and a visual display, e.g., a dashboard, which may be used tomonitor the processing system 200 and to communicate out-of-controlevents to a user are schematically represented in FIGS. 6A-6D and 7respectively.

FIG. 3 is a schematic representation of an advanced temperaturemonitoring system 320 configured for use with a plurality ofmulti-chamber processing systems 200, 300, according to one embodiment.Here, the advanced temperature monitoring system 320 includes a firstplurality of connection modules 322 configured to receive electricalconductors 232 coupled to the first and second sensors 145, 185 (shownin FIG. 2) which are used to monitor the temperatures of surfaces of a(first) multi-chamber processing system 200. The advanced temperaturemonitoring system 320 further includes a second plurality of connectionmodules 222 configured to receive electrical conductors 232 coupled tofirst and second sensors 145, 185 (FIG. 2) used to monitor thetemperatures of surfaces of a second multi-chamber processing system300. Here, the second multi-chamber processing system 300 is the same orsubstantially similar to the first multi-chamber processing system 200.The first and second pluralities of the connection modules 222 for therespective first and second multi-chamber processing systems 200, 300are each arranged in series and coupled to the ATMS controller 224 inthe manner described above in FIG. 2.

FIG. 4 is a schematic representation of an advanced temperaturemonitoring system 420 configured for use with a plurality ofmulti-chamber processing systems 200, 300, according to anotherembodiment. Here, the advanced temperature monitoring system 420includes a first plurality of the connection modules 222 correspondingto the first multi-chamber processing system 200 and a second pluralityof the connection modules 322 corresponding to the second multi-chamberprocessing system 300. The first and second pluralities of theconnection modules 222 are arranged in series with one another so thatat least one of the connection modules 222 corresponding to the firstmulti-chamber processing system 200 is connected to at least one of theconnection modules 222 corresponding to the second multi-chamberprocessing system 300.

FIG. 5 is a diagram illustrating a method 500 of monitoring a pluralityof surfaces of a processing system for changes in temperature using theadvanced temperature monitoring systems described herein. At activity505 the method 500 includes receiving, using an advanced temperaturemonitoring system (ATMS) controller, information from a first pluralityof temperature sensors and a second plurality of temperature sensors.Generally, individual ones of the first and second pluralities oftemperature sensors are disposed in locations external to one or moreprocessing volumes of one or more corresponding processing chambers.

In some embodiments, individual ones of the first or second pluralitiesof temperature sensors are disposed on, located proximate to, locatedadjacent to, or are in intimate contact with one or more surfaces of theprocessing system including surfaces of one or more load lock chambers,one or more transfer chambers, one or more robot handlers, one or moremotors respectively coupled to the one or more robot handlers, one ormore doors or valves disposed between the one or more transfer chambersand one or more processing chambers, one or more doors or valvesdisposed between the one or more transfer chambers and the one or moreload lock chambers, one or more gas supply cabinets, one or moreliquid-phase precursor ampoules, respective substrate support shafts ofthe one or more processing chambers, respective lift hoop shafts of theone or more processing chambers, one or more first actuatorsrespectively coupled the substrate support shafts to the one or moreprocessing chambers, one or more second actuators respectively coupledto the lift hoop shafts one the or more processing chambers, respectiveexhaust conduits fluidly coupled to the one or more processing chambers,respective dedicated chamber exhaust pumps, respective forelines,respective chamber walls of the one or more processing chambers,respective chamber lid assemblies of the one or more processingchambers, respective chamber bases of the one or more processingchambers, a plurality of locations along at least portions of lengths ofone or more vapor-phase delivery conduits, or combinations thereof.

In some embodiments, the advanced temperature monitoring systemcomprises the first and second pluralities of temperature sensors, theATMS controller, a first connection module, and a second connectionmodule. The first connection module comprises a first housing having oneor more first terminal blocks disposed therein and the second connectionmodule comprises a second housing having one or more second terminalblocks disposed therein. In some embodiments, each of the firstplurality of sensors are coupled to corresponding connection terminalsof the one or more first terminal blocks and each of the secondplurality of sensors are coupled to corresponding connection terminalsof the one or more second terminal blocks. Here, the first and secondconnection modules are arranged in series so that the first connectionmodule is coupled to the second connection module using a first cableand the second connection module is coupled to the ATMS controller usinga second cable.

At activity 510 the method 500 includes comparing, using the ATMScontroller, the temperature information to one or more pre-determinedcontrol limits. Examples of statistical process control (SPC) models 600a-d which may be used with the method 500 are respectively illustratedin FIGS. 6A-6D. In FIG. 6A the first SPC model 600 a may be used by theATMS controller to monitor temperatures (T) of one or more temperaturesensors by comparing the temperature measurements 601 to a predeterminedlower control limit (LCL). The temperature T, as measured by acorresponding sensor, is plotted on the SPC chart over time (t). The SPCmodel 600 b of FIG. 6B may be used by the ATMS controller to comparetemperature measurements 601 from corresponding temperature sensors toan upper control limit (UCL). The SPC models 600 c,d of FIGS. 6C,6D maybe used by the ATMS controller to compare temperature measurements 601of corresponding sensors to both lower control limits (LCL) and uppercontrol limits (UCL). When a temperature measurement 601 falls below aLCL or exceeds an UCL a corresponding out-of-control event 602 is storedin the memory of the ATMS controller before and/or concurrently withcommunicating the out-of-control event 602 to a user at activity 515.

At activity 515 the method 500 includes communicating, using the ATMScontroller, an out-of-control event 602 to a user, wherein the out ofcontrol event comprises a temperature measurement above and/or below theone or more pre-determined control limits, e.g, the LCL and/or UCLillustrated in FIGS. 6A-6D. In some embodiments, the method 500optionally includes displaying, using the ATMS controller, a visualrepresentation of temperature information obtained using the advancedtemperature monitoring system such as one or more of the dashboards ofthe visual display scheme 700 schematically represented in FIG. 7.

In some embodiments, the method 500 further includes receiving, usingthe ATMS controller, system processing information from a systemcontroller coupled to the processing system.

In some embodiments, the method 500 further includes, generatinghistorical processing data comprising temperature information, systemprocessing information, and day and time information. In someembodiments, the method 500 further includes storing the historicalprocessing data in a memory of the ATMS controller. In some embodimentsthe method 500 further includes comparing the historical processing datato one or more pre-determined control limits. In some embodiments, themethod 500 further includes communicating an out-of-control event to auser, where the out-of-control event comprises one or more historicaldata points above or below one or more pre-determined control limits. Insome embodiments of the method 500, the system processing informationcomprises substrate processing information, maintenance operationinformation, or a combination thereof.

The method 500 enables a user of an advanced temperature monitoringsystem to contemporaneously view temperature measurements of, orproximate to, a vapor-phase precursor delivery conduit, at a pluralityof locations along the length, or a portion of the length, thereof.Further, in some embodiments, the ATMS controller 224 is configured,using sensor identification information, to display the approximaterespective locations of each temperature measurement which is beneficialfor troubleshooting and or standard maintenance procedure purposes. Forexample, in troubleshooting a temperature excursion a user can determineand approximate location of the excursion using corresponding sensoridentification information displayed by the ATMS controller. In anotherexample, a maintenance procedure may require a user, using the advancedmonitoring system, to ensure that the temperature of the vapor-phasedelivery conduit is at a uniform desired temperature along the lengththereof before the user returns the system controller to a substrateprocessing mode. By ensuring the temperature of the vapor-phase deliveryconduit is at a uniform desired temperature before flowing a vapor-phasethereinto, undesirable condensation in the vapor-phase delivery conduitcan be avoided along with particle contamination issues associatedtherewith.

The method 500 further enables process development and improvement, andimproved statistical process control, based on statistical analysis ofhistorical information for one or more processing events. For example,statistical analysis of historical information may reveal that sometemperature excursions correlate to a specific process sequence orsequence activity and a change in the sequence or sequence activitymight substantially reduce, and/or eliminate the temperature excursionand, therefore, reduce or eliminate particle contamination issuesassociated therewith.

Here, the visual display scheme 700 is configured for use with one ormore multi-chamber processing systems, such as one or both of theProducer™ or Centura™ multi-chamber processing platforms available fromApplied Materials Inc., of Santa Clara, Calif. As shown in FIG. 7, thevisual display scheme 700 includes a fab level dashboard 710, aprocessing system dashboard 720, a univariate analysis (UVA) trend chart730, and a temperature trace chart 740. Information for each of thedashboards and/or charts may be compiled by the ATMS controller 224 as areport 750 for any desired time period. Here, the fab level dashboard710 provides a visual display of any desirable information communicatedto the ATMS controller 224 from the fab-level control system 246, one ormore system controllers 207, 307 of corresponding processing systems200, 300, or both. For example, here the fab level dashboard 710includes a visual representation, e.g., graphs 711 of one or moresubstrate measurements taken before, after, and/or concurrent withsubstrate processing in a substrate processing system. Examples ofsubstrate measurements include film thickness measurements and/orsurface defectivity measurements taken using a suitable metrologysystem. Metrology systems used to provide the substrate measurements maybe integrated with a substrate processing system 200, 300 and/or may bea stand-alone metrology system. Such substrate measurements may becommunicated to the temperature monitoring system ATMS controller 224via a system controller 207, 307 and/or the fab-level control system246. In some embodiments, the substrate measurements shown in the fablevel dashboard 710 are an average of a plurality of substratemeasurements taken over a given time period, e.g., and average ofsubstrate measurements taken over a day. Here, the fab level dashboard710 further includes a visual representation of processing excursionsfor different processing parameters such as temperatures provided by theadvanced temperature monitoring system described herein and otherprocessing parameters, such as pressure, flowrates, and power requiredto ignite and maintain a processing plasma.

Here, each of the processing systems represented in the fab-leveldashboard 710 has a corresponding processing system dashboard 720 whichis configured to provide a visual display of temperature excursions foreach of the temperature sensors 145, 185 used therewith. In theprocessing system dashboard 720 each of the temperature sensors 145, 185is represented as a ATMS channel (e.g., Ch21, Ch22, . . . ) and areshown as arranged in rows. Corresponding columns A, B, C representprocessing system health as determined by each of the SPC models 600 a-ddescribed above for FIGS. 6A-6D and/or further statistical analysisthereof. For example, in some embodiments each of the columns A, B, C,are configured to visually represent the processing system health basedon a univariate analysis of temperature information corresponding toeach of the temperature sensors, such as shown in the UVA trend chart730. Here, the processing system dashboard 720 shows processing systemhealth over a time period of the proceeding 24 hours although anydesirable time period may be selected.

The UVA trend chart 730 is a visual representation of a univariateanalysis of temperature measurements from an individual temperaturesensor taken over a desired time period. Here, each point 731 in the UVAtrend chart 730 represents univariate analysis of temperaturemeasurements taken during a material deposition process for anindividual substrate in an individual processing chamber. The verticaly-axis represents the percentage of temperature measurements during thedeposition process that fell outside of a control limit (above or below)as set forth for one of the SPC models 600 a-d described above. Thenumber of points 731 above an upper threshold, e.g., >50% arerepresented by a value # in column C, the number of points 731 betweenthe upper threshold of about 50% and a lower threshold, e.g., about 3%are represented as a value # in column B and the number of points 731below the lower threshold 3% are represented as a value in column Awhere a higher number # in column A as compare to columns B and C isdesired. Typically, each point 731 in the UVA trend chart 730 has acorresponding temperature trace chart 740 which a user may select to seethe temperature profile from an individual sensor 145, 185 during thedeposition process for an individual substrate.

FIG. 8 is a diagram of a method 800 of detecting processing temperatureexcursions in a processing system, according to one embodiment. It iscontemplated that any aspect of the method 800 may be incorporated intothe method 500 described above to facilitate monitoring and/or controlof a multi-chamber processing system using the advanced temperaturemonitoring systems described herein.

At activity 801, the method 800 includes receiving, at a temperaturemonitoring system (TMS) controller, such as the ATMS controller 224,information from a plurality of temperature sensors disposed external toa processing volume of a processing chamber. At activity 802, the method800 includes storing, in the memory of the TMS controller, datacorresponding to the information received from each of the plurality oftemperature sensors. At activity 803, the method 800 includes comparingthe data to one or more statistical process control models, such as oneof the statistical process control models 600 a-d described above. Atactivity 804, the method 800 includes determining, based on thecomparison of the data to the one or more process control models,whether a temperature excursion event has occurred. At activity 805, themethod 800 includes displaying, for a user, a visual representation oftemperature excursion events corresponding to each of the plurality oftemperature sensors. In some embodiments, displaying the visualrepresentation of excursion event is done using the visual displayscheme 700 of FIG. 7.

While the foregoing is directed to embodiments of the presentdisclosure, other and further embodiments of the disclosure may bedevised without departing from the basic scope thereof, and the scopethereof is determined by the claims that follow.

1. A method of monitoring one or more processing systems, comprising:monitoring, using a temperature monitoring system (TMS), a plurality ofsurfaces of the one or more processing systems for changes intemperature, comprising: receiving, at a temperature monitoring system(TMS) controller, information from a first plurality of temperaturesensors and a second plurality of temperature sensors, wherein thetemperature monitoring system comprises the first and second pluralitiesof temperature sensors, the TMS controller, a first connection module,and a second connection module, the first connection module comprises afirst housing having one or more first terminal blocks disposed therein,the second connection module comprises a second housing having one ormore second terminal blocks disposed therein, individual ones of thefirst and second pluralities of temperature sensors are disposed inlocations external to one or more processing volumes of one or morecorresponding processing chambers within the one or more processingsystems; each of the first plurality of temperature sensors are coupledto corresponding connection terminals of the one or more first terminalblocks, each of the second plurality of temperature sensors are coupledto corresponding connection terminals of the one or more second terminalblocks, and the first and second connection modules are arranged inseries so that the first connection module is coupled to the secondconnection module using a first cable and the second connection moduleis coupled to the TMS controller using a second cable; comparing, usingthe TMS controller, the temperature information to one or morepre-determined control limits; and communicating, using the TMScontroller, an out-of-control event to a user, wherein the out ofcontrol event comprises a temperature measurement above or below the oneor more pre-determined control limits.
 2. The method of claim 1, whereinindividual ones of the first and second pluralities of temperaturesensors are at least one of disposed on, located proximate to, locatedadjacent to, and/or are disposed in intimate contact with one or moresurfaces of the processing system including surfaces of one or more loadlock chambers, one or more transfer chambers, one or more robothandlers, one or more motors respectively coupled to the one or morerobot handlers, one or more doors or valves disposed between the one ormore transfer chambers and one or more processing chambers, one or moredoors or valves disposed between the one or more transfer chambers andthe one or more load lock chambers, one or more gas supply cabinets, oneor more liquid-phase precursor ampoules, respective substrate supportshafts of the one or more processing chambers, respective lift hoopshafts of the one or more processing chambers, one or more firstactuators respectively coupled the substrate support shafts to the oneor more processing chambers, one or more second actuators respectivelycoupled to the lift hoop shafts one the or more processing chambers,respective exhaust conduits fluidly coupled to the one or moreprocessing chambers, respective dedicated chamber exhaust pumps,respective forelines, respective chamber walls of the one or moreprocessing chambers, respective chamber lid assemblies of the one ormore processing chambers, respective chamber bases of the one or moreprocessing chambers, a plurality of locations along at least portions oflengths of one or more vapor-phase delivery conduits, or combinationsthereof.
 3. The method of claim 1, further comprising receiving, at theTMS controller, system processing information from a system controllercoupled to the processing system, wherein the system processinginformation relates to instructions executed by the system controller tocontrol one or more operations of the processing system.
 4. The methodof claim 3, further comprising: communicating, using the TMS controller,the out-of-control event to the system controller.
 5. The method ofclaim 3, further comprising: generating data comprising temperatureinformation, system processing information, and day and time informationcorresponding to the temperature information and the system processinginformation; storing the generated data in a memory of the TMScontroller; comparing the generated data to one or more pre-determinedcontrol limits; and communicating an out-of-control event to a user,wherein the out-of-control event comprises one or more of the generateddata points comprising a temperature measurement or a value calculatedfrom one or more temperature measurements which is above or below theone or more pre-determined control limits.
 6. The method of claim 1,wherein the one or more processing systems further comprise: a firstvapor-phase precursor source and a first vapor-phase precursor deliveryconduit fluidly coupling the first vapor-phase precursor source to afirst processing volume of a first processing chamber; and a secondvapor-phase precursor source and a second vapor-phase precursor deliveryconduit fluidly coupling the second vapor-phase precursor source to asecond processing volume of a second processing chamber, whereinindividual ones of the first and second pluralities of temperaturesensors are at least one of disposed on, disposed adjacent to, disposedproximate to, or in intimate contact with the first vapor-phaseprecursor delivery conduit, and the first processing chamber and thesecond processing chamber are connected by a transfer chamber to form amulti-chamber processing system.
 7. The method of claim 1, wherein theone or more processing systems further comprise: a first vapor-phaseprecursor source and a first vapor-phase precursor delivery conduitfluidly coupling the first vapor-phase precursor source to a firstprocessing volume of a first processing chamber; and a secondvapor-phase precursor source and a second vapor-phase precursor deliveryconduit fluidly coupling the second vapor-phase precursor source to asecond processing volume of a second processing chamber, whereinindividual ones of the first and second pluralities of temperaturesensors are at least one of disposed on, disposed adjacent to, disposedproximate to, or in intimate contact with the first vapor-phaseprecursor delivery conduit, and the first processing chamber is one of aplurality of chambers of a first multi-chamber processing system and thesecond processing chamber is one of a plurality of chambers of a secondmulti-chamber processing system which is separate and distinct from thefirst multi-chamber processing system.
 8. A method of detectingprocessing temperature excursions in a processing system, comprising:receiving, at a temperature monitoring system (TMS) controller,information from a plurality of temperature sensors disposed external toa processing volume of a processing chamber; storing, in a memory of theTMS controller, data corresponding to the information received from eachof the plurality of temperature sensors; comparing the data to one ormore process control models; determining, based on the comparison of thedata to the one or more process control models, whether a temperatureexcursion event has occurred; and displaying, for a user, a visualrepresentation of temperature excursion events corresponding to each ofthe plurality of temperature sensors.
 9. The method of claim 8, whereinthe processing system comprises a vapor-phase precursor source and avapor-phase precursor delivery conduit fluidly coupling the vapor-phaseprecursor source to the processing volume of the processing chamber. 10.The method of claim 9, wherein one or more of the plurality oftemperature sensors are disposed on, disposed adjacent to, disposedproximate to, or are disposed in intimate contact with the vapor-phaseprecursor delivery conduit.
 11. The method of claim 10, wherein theprocessing system further comprises a processing system controller usedto control one or more operations of the processing system, and whereinthe method further comprises receiving, at the TMS controller, systemprocessing information from the processing system controller.
 12. Themethod of claim 11, further comprising: communicating, using the TMScontroller, a temperature excursion event to the system controller. 13.The method of claim 10, further comprising: generating data comprisingtemperature information, system processing information, and day and timeinformation corresponding to the temperature information and the systemprocessing information; storing the generated data in a memory of theTMS controller; comparing the generated data to one or morepre-determined control limits; and communicating an out-of-control eventto a user, wherein the out-of-control event comprises one or more of thegenerated data points comprising a temperature measurement or a valuecalculated from one or more temperature measurements which is above orbelow the one or more pre-determined control limits.
 14. The method ofclaim 8, wherein individual ones of the plurality of temperature sensorsare at least one of disposed on, located proximate to, located adjacentto, or in intimate contact with one or more surfaces of the processingsystem including surfaces of one or more load lock chambers, one or moretransfer chambers, one or more robot handlers, one or more motorsrespectively coupled to the one or more robot handlers, one or moredoors or valves disposed between the one or more transfer chambers andone or more processing chambers, one or more doors or valves disposedbetween the one or more transfer chambers and the one or more load lockchambers, one or more gas supply cabinets, one or more liquid-phaseprecursor ampoules, respective substrate support shafts of the one ormore processing chambers, respective lift hoop shafts of the one or moreprocessing chambers, one or more first actuators respectively coupledthe substrate support shafts to the one or more processing chambers, oneor more second actuators respectively coupled to the lift hoop shaftsone the or more processing chambers, respective exhaust conduits fluidlycoupled to the one or more processing chambers, respective dedicatedchamber exhaust pumps, respective forelines, respective chamber walls ofthe one or more processing chambers, respective chamber lid assembliesof the one or more processing chambers, respective chamber bases of theone or more processing chambers, a plurality of locations along at leastportions of lengths of one or more vapor-phase delivery conduits, orcombinations thereof.
 15. A temperature monitoring system, comprising: afirst plurality of temperature sensors; a second plurality oftemperature sensors; a temperature monitoring system (TMS) controller; afirst connection module comprising a first housing and one or more firstterminal blocks disposed therein; and a second connection modulecomprising a second housing having one or more second terminal blocksdisposed therein, wherein each of the first plurality of temperaturesensors are coupled to corresponding connection terminals of the one ormore first terminal blocks, each of the second plurality of temperaturesensors are coupled to corresponding connection terminals of the one ormore second terminal blocks, and the first and second connection modulesare arranged in series so that the first connection module is coupled tothe second connection module using a first cable and the secondconnection module is coupled to the TMS controller using a second cable.16. The temperature monitoring system of claim 15, wherein individualones of the first and second pluralities of temperature sensors aredisposed in locations external to one or more processing volumes of oneor more corresponding processing chambers.
 17. The temperaturemonitoring system of claim 16, further comprising a computer readablemedium having instructions stored thereon for performing a method whenexecuted by a processor, the method comprising: receiving, at the TMScontroller, information from the first plurality of temperature sensorsand the second plurality of temperature sensors; comparing, using theTMS controller, the temperature information to one or morepre-determined control limits; and communicating, using the TMScontroller, an out-of-control event to a user, wherein the out ofcontrol event comprises a temperature measurement above or below the oneor more pre-determined control limits.
 18. The temperature monitoringsystem of claim 15, further comprising a computer readable medium havinginstructions stored thereon for performing a method when executed by aprocessor, the method comprising: receiving, at the temperaturemonitoring system (TMS) controller, information from a plurality oftemperature sensors disposed external to a processing volume of aprocessing chamber; storing, in a memory of the TMS controller, datacorresponding to the information received from each of the plurality oftemperature sensors; comparing the data to one or more process controlmodels; determining, based on the comparison of the data to the one ormore process control models, whether a temperature excursion event hasoccurred; and displaying, for a user, a visual representation oftemperature excursion events corresponding to each of the plurality oftemperature sensors.
 19. The temperature monitoring system of claim 17,wherein the method further comprises receiving, at the TMS controller,system processing information from a system controller coupled to theprocessing system, wherein the system processing information relates toinstructions executed by the system controller to control one or moreoperations of the processing system.
 20. The temperature monitoringsystem of claim 17, wherein the method further comprises: generatingdata comprising temperature information, system processing information,and day and time information corresponding to the temperatureinformation and the system processing information; and storing thegenerated data in a memory of the TMS controller.